Adix SA duo
The Adix SA duo is the fastest dual table imaging system with a customized number of photoheads & stripes. Boasting a BeamLight™ multi-channel lightsource or 2 to 7 ALDS Power 4+ Photo Heads (upgradeable on-site)..
It is dedicated to all processes.
主要特点
| Process | Inner Layer, Outer Layer & Soldermask / PSR |
| Exposure Area | Up to 2 x 610 x 762mm | 2 x 24 x 30’’ |
| Resolution | Dry film :15µm/15µm | 0.6/0.6 mil (L&S) Soldermask : min DAM 25µm | 1 mil |
| Light Engine | BeamLight™ Multi Channel - 4 Wavelengths ALDS-Power4™ High UV Power with 4 LEDs per Photo Head |
| 'Panel Thickness | 0.04mm to 6mm | 0.0016” to 0.236” |
| 'Light Engine | LED Light source ALDS-Power4™ |
| 'Edge Roughness | ±2,5µm | ±0.09mil |
| 'Depth of Focus | ±200µm | ±8mils |
| 'Autofocus | ±8mm | ±315mils |
| 'Exposure Spectrum | 4 LEDs wavelengths per Photo Head: 365/380/395/405nm |
| 'Imaging Resist Materials | All Solder & Conventional Dry Film Resists |
| 'Exposure Method | Real Time Scaling & Partitioning with all kinds of fiducials |
| 'Alignment | ±8μm | 0.3mil (Image to Panel Registration) ±12μm | 0.5mil (Side to Side Registration) |
| 'CCD Cameras | 2 Cameras - for Outer Layers (Alignment on 4 Holes) - for Soldermask Registration (Alignment on 4 Copper Targets) 3 Cameras - for Inner Layers (Alignment on 3 Fiducials) |
| 'Throughput | 65s with 300mJ/cm2 resist for 457 x 610mm (18’’x 24’’) image size and with 5 Heads |
| 'Construction | Stainless steel |
| 'Software | Altix Suite with 22” touch screen |
| 'Data Input | Extended Gerber, ODB++ (others upon request) |
| 'Air Cleanliness | Hepa filter class 100 |
| 'Languages | English, Simplified & Traditional Chinese, Korean, German, French… |
Adix SA
Adix SA是一款UV LED DMD直接成像设备，适用于各种需要直接成像的应用。基于其全新的ALDS-Power4+™技术，每个成像头配有4波长的UV LED 光源。
该设备适用于中/高批量，或少量多样的生产需求
主要特点
| 制程应用 | 内层，外层，防焊/ PSR |
| 曝光面积 | 从228 x 254mm到610 x 762mm |从 9” x 10”到24” x 30” |
| 解析度 | 干膜 : 20µm/20µm |0.8mil/0.8mil (线宽线距) 阻焊桥最小可达25µm | 1mi |
| 光源 | ALDS-Power4+™ 极短的数据预处理时间 高功率 UV –LED,每个成像头配置4个LED |
| '板厚 | 0.04mm 到 6mm | 0.0016” 到 0.236” |
| '光源 | LED光源 ALDS-Power4+™ |
| '边缘粗糙度 | ±1,5µm | ±0.05mil |
| '景深 | 200µm | 8mils |
| '自动对焦 | ±8mm | ±315mils |
| '曝光光谱 | 每个成像头配置4波长LED光源：365/380/395/405nm |
| '对位精度 | ±8μm | 0.3mil (片对板对位精度) ±12μm | 0.5mil (层间对位精度) |
| 'CCD摄像头 | 2个CCD摄像头 -外层（ 4个通孔靶标对位） -防焊对位精度（4个铜箔靶标对位) 3个CCD摄像头-内层（3个光学靶标对位） |
| '产能 | 14秒：30mJ/cm2曝光能量为基准，成像尺寸457 x 610mm (18’’x 24’’) ，使用6个成像头 |
| '制程应用 | 内层，外层，防焊/ PSR |
| '曝光面积 | 最大 228mm x 254mm | 最大 9’’x10’’ up to 24”x30” |
| '解析度 | Dry Film: 10µm/10µm | 0.4mil/0.4mil (线宽线距) Soldermask: Min Dam 25µm | 1mil 阻焊桥最小可达 |
| '光源 | ALDS-Power4+™ Data preprocessing in hidden time + High UV Power with 4 LEDs per Photo Head |
Adix SA neo
产速更快更智能： Adix SA neo在ADIX SA的基础上生能提升了20%到30%
Adix SA neo是一款UV LED DMD 直接成像设备，适用于各种需要直接成像的应用。每个成像头配有4波长的高功率 neo UV LED 光源。
该设备适用于中/高批量，或少量多样的生产需求
主要特点
| Process | Inner Layers, Outer Layers & Soldermask / PSR |
| Exposure Area | From 250 x 250 mm up to 635 x 762 mm | From 10"x10" up to 25"x30" |
| Resolution | Dry Film : 8µm/12µm |0.3mil/0.5mil (Line & Space) Soldermask : min Dam 25µm | 1.2 mil |
| Productivity | 20 to 30% productivity increase compared to Adix SA |
| Light Engine | High UV uno Power with 4 LEDs per Photo Head |
Acura SA
The Acura SA is a semi-automatic exposure range of units operating in double side mode with different light sources, including LEDs, for fine line resolution on dry film and liquid soldermask.
The machine is adapted to high and medium volume production.
It can handle all types of rigid or flex material, PCB, FPC, Photo Chemical Milling, Thin Film Photovoltaic, Touch Panel… for all processes and was designed to reach the best-cost performance ratio.
主要特点
| Process | Inner Layers, Outer Layers & Soldermask / PSR |
| Exposure Area | Up to 610mm x 762mm | Up to 24'' x 30'' |
| Resolution | Dry Film :25µm/25µm | 1mil/1mil Line & Space Soldermask: min DAM 50µm | 2mil |
| Light Engine | LedLight™ ColliLight™ 5kW & 8kW Mach 5® |
Adix SA supra
Adix SA supra is a UV LED DMD Direct Imaging solution designed for IC Substrate and Advanced Packaging applications, utilizing ALDS-Power4+™ technology featuring 4 LEDs per photo head.
The solution is tailored high mix low and medium volume production.
主要特点
| Process | FOPLP, FOWLP, FCBGA, FCCSP |
| Exposure Area | Up to 600x600mm | Up to 23.6''x23.6'' |
| Resolution | Pattern: Pitch 20µm (8 to 12µm Line) SolderMask: SRO 40µm |
| Light Engine | ALDS-Power4+ Data preprocessing in hidden time High UV Power with 4 LEDs per Photo Head |
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