Adix SA duo
The Adix SA duo is the fastest dual table imaging system with a customized number of photoheads & stripes. Boasting a BeamLight™ multi-channel lightsource or 2 to 7 ALDS Power 4+ Photo Heads (upgradeable on-site)..
It is dedicated to all processes.
主要特点
| Process | Inner Layer, Outer Layer & Soldermask / PSR |
| Exposure Area | Up to 2 x 610 x 762mm | 2 x 24 x 30’’ |
| Resolution | Dry film :15µm/15µm | 0.6/0.6 mil (L&S) Soldermask : min DAM 25µm | 1 mil |
| Light Engine | BeamLight™ Multi Channel - 4 Wavelengths ALDS-Power4™ High UV Power with 4 LEDs per Photo Head |
| 'Panel Thickness | 0.04mm to 6mm | 0.0016” to 0.236” |
| 'Light Engine | LED Light source ALDS-Power4™ |
| 'Edge Roughness | ±2,5µm | ±0.09mil |
| 'Depth of Focus | ±200µm | ±8mils |
| 'Autofocus | ±8mm | ±315mils |
| 'Exposure Spectrum | 4 LEDs wavelengths per Photo Head: 365/380/395/405nm |
| 'Imaging Resist Materials | All Solder & Conventional Dry Film Resists |
| 'Exposure Method | Real Time Scaling & Partitioning with all kinds of fiducials |
| 'Alignment | ±8μm | 0.3mil (Image to Panel Registration) ±12μm | 0.5mil (Side to Side Registration) |
| 'CCD Cameras | 2 Cameras - for Outer Layers (Alignment on 4 Holes) - for Soldermask Registration (Alignment on 4 Copper Targets) 3 Cameras - for Inner Layers (Alignment on 3 Fiducials) |
| 'Throughput | 65s with 300mJ/cm2 resist for 457 x 610mm (18’’x 24’’) image size and with 5 Heads |
| 'Construction | Stainless steel |
| 'Software | Altix Suite with 22” touch screen |
| 'Data Input | Extended Gerber, ODB++ (others upon request) |
| 'Air Cleanliness | Hepa filter class 100 |
| 'Languages | English, Simplified & Traditional Chinese, Korean, German, French… |
Adix SA
Adix SA是一款UV LED DMD直接成像设备，适用于各种需要直接成像的应用。基于其全新的ALDS-Power4+™技术，每个成像头配有4波长的UV LED 光源。
该设备适用于中/高批量，或少量多样的生产需求
主要特点
| 制程应用 | 内层，外层，防焊/ PSR |
| 曝光面积 | 从228 x 254mm到610 x 762mm |从 9” x 10”到24” x 30” |
| 解析度 | 干膜 : 20µm/20µm |0.8mil/0.8mil (线宽线距) 阻焊桥最小可达25µm | 1mi |
| 光源 | ALDS-Power4+™ 极短的数据预处理时间 高功率 UV –LED,每个成像头配置4个LED |
| '板厚 | 0.04mm 到 6mm | 0.0016” 到 0.236” |
| '光源 | LED光源 ALDS-Power4+™ |
| '边缘粗糙度 | ±1,5µm | ±0.05mil |
| '景深 | 200µm | 8mils |
| '自动对焦 | ±8mm | ±315mils |
| '曝光光谱 | 每个成像头配置4波长LED光源：365/380/395/405nm |
| '对位精度 | ±8μm | 0.3mil (片对板对位精度) ±12μm | 0.5mil (层间对位精度) |
| 'CCD摄像头 | 2个CCD摄像头 -外层（ 4个通孔靶标对位） -防焊对位精度（4个铜箔靶标对位) 3个CCD摄像头-内层（3个光学靶标对位） |
| '产能 | 14秒：30mJ/cm2曝光能量为基准，成像尺寸457 x 610mm (18’’x 24’’) ，使用6个成像头 |
| '制程应用 | 内层，外层，防焊/ PSR |
| '曝光面积 | 最大 228mm x 254mm | 最大 9’’x10’’ up to 24”x30” |
| '解析度 | Dry Film: 10µm/10µm | 0.4mil/0.4mil (线宽线距) Soldermask: Min Dam 25µm | 1mil 阻焊桥最小可达 |
| '光源 | ALDS-Power4+™ Data preprocessing in hidden time + High UV Power with 4 LEDs per Photo Head |
Adix SA neo
产速更快更智能： Adix SA neo在ADIX SA的基础上生能提升了20%到30%
Adix SA neo是一款UV LED DMD 直接成像设备，适用于各种需要直接成像的应用。每个成像头配有4波长的高功率 neo UV LED 光源。
该设备适用于中/高批量，或少量多样的生产需求
主要特点
| 制程应用 | 内层，外层，防焊/ PSR |
| 曝光面积 | 从228 x 254mm到610 x 762mm |从 9” x 10”到24” x 30” |
| 解析度 | 干膜 : 30µm/30µm |1.2mil/1.2mil (线宽线距) 阻焊桥最小可达25µm | 1mi |
| 产能 | 在上一代Adix SA的基础上产能提升了20%到30% |
| 光源系统 | 每个成像头都有4波长的高功率neo UV-LED |
| '板厚 | 0.04mm 到 6mm | 0.0016” 到 0.236” |
| '解析度 | 低至30µm/1.2mil |
| '产能 | 大于6600面/每天 |
| '光源 | LED光源 每个成像头配有4波长的高功率 neo UV LED 光源 |
| '边缘粗糙度 | ±1,5µm | ±0.05mil |
| '景深 | 200µm | 8mils |
| '自动对焦 | ±8mm | ±315mils |
| '曝光光谱 | 每个成像头配置4波长LED光源：365/380/395/405nm |
| '对位精度 | ±8μm | 0.3mil (片对板对位精度) ±12μm | 0.5mil (层间对位精度) |
| 'CCD摄像头 | 2个CCD摄像头 -外层（ 4个通孔靶标对位） -防焊对位精度（4个铜箔靶标对位) 3个CCD摄像头-内层（3个光学靶标对位） |
Adix SA supra
Adix SA supra is a UV LED DMD Direct Imaging solution designed for IC Substrate and Advanced Packaging applications, utilizing ALDS-Power4+™ technology featuring 4 LEDs per photo head.
The solution is tailored high mix low and medium volume production.
主要特点
| Process | FOPLP, FOWLP, FCBGA, FCCSP |
| Exposure Area | Up to 600x600mm | Up to 23.6''x23.6'' |
| Resolution | Pattern: Pitch 20µm (8 to 12µm Line) SolderMask: SRO 40µm |
| Light Engine | ALDS-Power4+ Data preprocessing in hidden time High UV Power with 4 LEDs per Photo Head |
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