Acura Premium Series
The Acura Premium Series is an automatic exposure range of units operating in double side mode with different light sources, including LEDs, for fine line resolution on dry film and liquid soldermask.
Main characteristics
| Process | Inner Layers, Outer Layers & Soldermask / PSR |
| Exposure Area | Up to 610mm x 762mm | Up to 24” x 30” |
| Resolution | Dry Film : 15µm/15µm | 0.6mil/0.6mil (L&S) Soldermask : min Dam 60µm | 2.4mil |
| Light Engine | LedLight™ ColliLight™ 5kW & 8kW OmniLight™ |
| 'Process | Inner Layers & Outer Layers |
| 'Exposure Area | Up to 610mm x 762mm | Up to 24” x 30” |
| 'Resolution | Dry film: 15µm/15µm | 0.6mil/0.6mil (Line & Space) |
| 'Light Engine | LedLight™ ColliLight™ 5kW & 8kW |
Adix SA duo
The Adix SA duo is the fastest dual table imaging system with a customized number of photoheads & stripes. Boasting a BeamLight™ multi-channel lightsource or 2 to 7 ALDS Power 4+ Photo Heads (upgradable on-site).
It is dedicated to all processes.
Main characteristics
| Process | Inner Layer, Outer Layer & Soldermask / PSR |
| Exposure Area | Up to 2 x 635 x 762mm | 2 x 25 x 30’’ |
| Resolution | Dry film :10µm/10µm | 0.4/0.4 mil (L&S) Soldermask : min DAM 50µm | 2 mil |
| Light Engine | BeamLight™ Multi Channel - 4 Wavelengths ALDS-Power4™ High UV Power with 4 LEDs per Photo Head |
| 'Panel Thickness | 0.04mm to 6mm | 0.0016” to 0.236” |
| 'Light Engine | LED Light source ALDS-Power4™ |
| 'Edge Roughness | ±2,5µm | ±0.09mil |
| 'Depth of Focus | ±200µm | ±8mils |
| 'Autofocus | ±8mm | ±315mils |
| 'Exposure Spectrum | 4 LEDs wavelengths per Photo Head: 365/380/395/405nm |
| 'Imaging Resist Materials | All Solder & Conventional Dry Film Resists |
| 'Exposure Method | Real Time Scaling & Partitioning with all kinds of fiducials |
| 'Alignment | ±8μm | 0.3mil (Image to Panel Registration) ±12μm | 0.5mil (Side to Side Registration) |
| 'CCD Cameras | 2 Cameras - for Outer Layers (Alignment on 4 Holes) - for Soldermask Registration (Alignment on 4 Copper Targets) 3 Cameras - for Inner Layers (Alignment on 3 Fiducials) |
| 'Throughput | 65s with 300mJ/cm2 resist for 457 x 610mm (18’’x 24’’) image size and with 5 Heads |
| 'Construction | Stainless steel |
| 'Software | Altix Suite with 22” touch screen |
| 'Data Input | Extended Gerber, ODB++ (others upon request) |
| 'Air Cleanliness | Hepa filter class 100 |
| 'Languages | English, Simplified & Traditional Chinese, Korean, German, French… |
Adix SA
Adix SA is an UV LED DMD Direct Imaging solution for all Direct Imaging applications based on its new ALDS-Power4+™ technology with 4 LEDs per photo head.
The solution is dedicated to high mix low and medium volume production.
Main characteristics
| Process | Inner Layers, Outer Layers & Soldermask / PSR |
| Exposure Area | From 228 x 254mm up to 610 x 762mm | From 9’’x10’’ up to 24”x30” |
| Resolution | Dry Film : 20µm/20µm | 0.8mil/0.8mil (Line & Space) Soldermask : min Dam 25µm | 1mil |
| Light Engine | ALDS-Power4+™ Data preprocessing in hidden time High UV Power with 4 LEDs per Photo Head |
| 'Panel Thickness | 0.04mm to 6mm | 0.0016” to 0.236” |
| 'Light Engine | LED Light source ALDS-Power4+™ |
| 'Edge Roughness | ±1,5µm | ±0.05mil |
| 'Depth of Focus | 200µm | 8mils |
| 'Autofocus | ±8mm | ±315mils |
| 'Exposure Spectrum | 4 LEDs wavelengths per Photo Head: 365/380/395/405nm |
| 'Alignment | ±8μm | 0.3mil (Image to Panel Registration) ±12μm | 0.5mil (Side to Side Registration) |
| 'CCD Cameras | 2 Cameras - for Outer Layers (Alignment on 4 Holes) - for Soldermask Registration (Alignment on 4 Copper Targets) 3 Cameras - for Inner Layers (Alignment on 3 Fiducials) |
| 'Throughput | 14s with 30mJ/cm2 resist for 457 x 610mm (18’’x 24’’) image size and with 6 Heads |
| 'Process | Inner Layers, Outer Layers & Soldermask / PSR |
| 'Exposure Area | From 228 x 254mm up to 610 x 762mm | From 9’’x10’’ up to 24”x30” |
| 'Resolution | Dry Film: 10µm/10µm | 0.4mil/0.4mil (Line & Space) Soldermask: Min Dam 25µm | 1mil |
| 'Light Engine | ALDS-Power4+™ Data preprocessing in hidden time High UV Power with 4 LEDs per Photo Head |
Adix PT / F
Adix SA can be incorporated with "Pass-Through Automation" allowing full automatic operation.
Adix PT/F is an UV LED DMD Direct Imaging solution based on its new ALDS-Power4+™Technology including 4 different LEDs per Photo-Head (with 4 different wavelengths).
Main characteristics
| Integrated Automation for Fully-Automatic Direct Imaging Process | |
| Up to 610 x 610mm / Cycle time of 10s per side thanks to a quick panel change | |
| Inline or Stand Alone solution / Pass Through side by side or Flip double side Production | |
| Multibatch mode / High mix & medium volume | |
| Dedicated for all resists : Dry Film & Soldermask / PSR |
| 'Panel Thickness | 0,04 to 6mm |
| 'Light Engine | ALDS-Power4+™ |
| 'Edge Roughness | ± 1,5µm |
| 'Depth of Focus | ± 100µm |
| 'Autofocus | Dynamic AF sensor per Head, stroke of ± 2 mm |
| 'Alignment | ± 12µm Side to Side Alignment ± 8µm Image to Panel (holes or pads) |
| 'CCD Cameras | Side to Side Alignment : 3 cameras Image to Panel Alignment : 2 cameras Image calibration : 1 camera |
| ' | Adix SA can be incorporated with « Pass-Through Automation » allowing full automatic operation |
| ' | Up to 610 x 610mm / Cycle time of 10s per side thanks to a quick panel change |
| ' | Inline or Stand Alone solution / Pass-Through side by side or Flip double side Production |
| ' | Multibatch / High mix & medium volume |
| ' | Dedicated for all resists: Dry Film & Soldermask |
Adix CS / F
The system is designed to automatically load and unload panels into an Adix Direct Imaging system. The machine has one loading/unloading port for angular L-Rack cassette where the panels are loaded.
Main characteristics
| Up to 610 x 610mm / Cycle time of 10s per side thanks to a quick panel change | |
| Modus AAA... to BBB... with intermediate buffer |
|
| Multibatch | |
| Dedicated for all resists : Dry Film & Soldermask |
| 'Panel Thickness | 0.05mm ~ 3.2mm (Optional 5mm) |
| 'Throughput | Cycle time 25 sec per side |
| 'Sensors | Integrated, intelligent double board detection Integrated interleave (slip sheet) detection |
| 'Double side | Flipping station with handshake |
| ' | Adix SA can be incorporated with " Compact Automation " allowing full automatic operation |
| ' | Up to 610 x 610mm / Cycle time of 10s per side thanks to a quick panel change |
| ' | Modus AAA... to BBB... with intermediate buffer |
| ' | Multibatch |
| ' | Dedicated for all resists: Dry Film & Soldermask |
Adix SA neo
Faster & Smarter solution : 20 to 30% productivity increase compared to Adix SA.
Adix SA neo is an UV LED DMD Direct Imaging solution for all Direct Imaging applications with high UV neo power with 4 LEDS per Photo Head.
The solution is dedicated to high mix low and medium volume production.
Main characteristics
| Process | Inner Layers, Outer Layers & Soldermask / PSR |
| Exposure Area | From 228 x 254mm up to 610 x 762mm | From 9’’x10’’ up to 24”x30” |
| Resolution | Dry Film : 30µm/30µm | 1.2mil/1.2mil (Line & Space) Soldermask : min Dam 30µm | 1.2mil |
| Productivity | 20 to 30% productivity increase compared to Adix SA |
| Light Engine | High UV neo Power with 4 LEDs per Photo Head |
| 'Panel Thickness | 0.04mm to 6mm | 0.0016” to 0.236” |
| 'Resolution | Down to 30μm | 1.2mil |
| 'Throughput | ⩾ 6600 prints/day |
| 'Light Engine | LED Light source UV neo Power with 4 LEDs per Photo Head |
| 'Edge Roughness | ±1,5µm | ±0.05mil |
| 'Depth of Focus | 200µm | 8mils |
| 'Autofocus | ±8mm | ±315mils |
| 'Exposure Spectrum | 4 LEDs wavelengths per Photo Head: 365/380/395/405nm |
| 'Alignment | ±8μm | 0.3mil (Image to Panel Registration) ±12μm | 0.5mil (Side to Side Registration) |
| 'CCD Cameras | 2 Cameras - for Outer Layers (Alignment on 4 Holes) - for Soldermask Registration (Alignment on 4 Copper Targets) 3 Cameras - for Inner Layers (Alignment on 3 Fiducials) |
Adix SA supra
Adix SA supra is a UV LED DMD Direct Imaging solution designed for IC Substrate and Advanced Packaging applications, utilizing ALDS-Power4+™ technology featuring 4 LEDs per photo head.
The solution is tailored high mix low and medium volume production.
Main characteristics
| Process | FOPLP, FOWLP, FCBGA, FCCSP |
| Exposure Area | Up to 600x600mm | Up to 23.6''x23.6'' |
| Resolution | Pattern: Design for L/S=8/8µm, Mass production with pitch of 20µm in SAP. SolderMask: SRO 30µm |
| Light Engine | ALDS-Power4+ Data preprocessing in hidden time High UV Power with 4 LEDs per Photo Head |
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