Adix SA duo

Panel / Sheet Semi-Automatic

The Adix SA duo is the fastest dual table imaging system with a customized number of photoheads & stripes. Boasting a BeamLight™ multi-channel lightsource or 2 to 7 ALDS Power 4+ Photo Heads (upgradeable on-site)..

It is dedicated to all processes.

It can handle all types of rigid or flex material, PCB, FPC, Metal Etching, Touch Panel for dry film and soldermask / PSR.

Designed to reach the best-cost performance ratio.

Benefits & exclusive features

Semi-Automatic Direct Imaging exposer dedicated to dry film & soldermask

Two options for light sources:
- BeamLight™ multi-channel - 4 wavelengths light source
- ALDS Power 4 + Photoheads
Flexible technology upgradable on site : photo heads can be added at any time
Highly engineered temperature regulation
Fast and easy LED replacement
2-side panel auto mechanical clamping system
Fast preprocessing service in hidden time
Vision lighting designed for different materials and finishing
Traceability : serial number, date, QR code…
Partitioning mode for multi panel printing
Machine built with appropriate selection of material
All in one built-in system
Etching offset : possible to adapt the size of printed graphic objects
Adjustable panel vacuum strength
Automatic vacuum fitting all size of panels
On-the-fly front to back registration without UV lasers
Edge/corner panel detection

Ein Angebot anfordern

Documentation:
Altix Product Range

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Process	Inner Layer, Outer Layer & Soldermask / PSR
Exposure Area	Up to 2 x 610 x 762mm \| 2 x 24 x 30’’
Resolution	Dry film :15µm/15µm \| 0.6/0.6 mil (L&S) Soldermask : min DAM 25µm \| 1 mil
Light Engine	BeamLight™ Multi Channel - 4 Wavelengths ALDS-Power4™ High UV Power with 4 LEDs per Photo Head

Panel Thickness	0.04mm to 6mm \| 0.0016” to 0.236”
Light Engine	LED Light source ALDS-Power4™
Edge Roughness	±2,5µm \| ±0.09mil
Depth of Focus	±200µm \| ±8mils
Autofocus	±8mm \| ±315mils
Exposure Spectrum	4 LEDs wavelengths per Photo Head: 365/380/395/405nm
Imaging Resist Materials	All Solder & Conventional Dry Film Resists
Exposure Method	Real Time Scaling & Partitioning with all kinds of fiducials
Alignment	±8μm \| 0.3mil (Image to Panel Registration) ±12μm \| 0.5mil (Side to Side Registration)
CCD Cameras	2 Cameras - for Outer Layers (Alignment on 4 Holes) - for Soldermask Registration (Alignment on 4 Copper Targets) 3 Cameras - for Inner Layers (Alignment on 3 Fiducials)
Throughput	65s with 300mJ/cm2 resist for 457 x 610mm (18’’x 24’’) image size and with 5 Heads
Construction	Stainless steel
Software	Altix Suite with 22” touch screen
Data Input	Extended Gerber, ODB++ (others upon request)
Air Cleanliness	Hepa filter class 100
Languages	English, Simplified & Traditional Chinese, Korean, German, French…