JCET confirms its choice for ADIX Direct Imaging
JCET has confirmed his choice to purchase ADIX in order to extend their production capacity and technology capabilities for its IC substrate products.
Frédéric Baradel, VP of Sales & Marketing, emphasized: “our ADIX solution complies with our customer requirements to achieve high performance in term of resolution and registration by polymerizing different kind of photoresists with high productivity”. Mr Baradel added “our unique light source ALDSTM, we incorporated, is able to image efficiently and quickly different kind of resists with different thicknesses, which could be up to 250μm thick. We are proud of this achievement and expect a good path for ADIX in the near future”.
About ADIX-SA
ADIX-SA is a semi-automatic UV LED DMD Direct Imaging solution based on its new ALDSTM technology, which is designed with high autofocus and depth-of-focus to accurately and efficiently image high resolution for lines/spaces down to 30μm plus to register at ±8μm the image to the panel on the most challenging surfaces and at the lowest cost.
About JCET
JCET (Jiangsu Changjiang Electronics Technology Co., Ltd.) is the largest Chinese packaging subcon, providing full turnkey packaging assembly and test services with one of the broadest package portfolios in BGA, flipchip, wafer-level, lead frame IC and discrete packages. JCET has been investing heavily in packaging technology development and innovation. It owns worldwide IP in copper pillar bumping and has been recently ramping up production of the latest Molded Interconnect System (MIS) technology.
